US EditionSpirit acquires SMART Microsystems, expands US chip capacity
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Advanced Chip Packaging/Microsystems Breakthroughs to be Presented at Upcoming IEEE ECTC Conference - Semiconductor Digest
The IEEE Electronic Components and Technology Conference (ECTC) is the world’s premier conference and product exhibition for bringing together the best in chip packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
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