US EditionAnsys expands collaboration with TSMC on design and process tools
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Ansys expands collaboration with TSMC on design and process tools
Ansys, in collaboration with TSMC, has introduced updates to its semiconductor tools, including AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs). The partnership also includes new tool certifications to support 3D integrated circuit (3D-IC) development and help meet design needs for AI and high-performance computing (HPC) applications. Additionally, Ansys and TSMC are expanding tool certific…
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