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Microchip Unveils New High-Density Power Module for AI at the Edge Applications

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Advanced 12A power module optimizes AI edge computing with 40% smaller footprint. Discover how this compact solution transforms industrial ...http://dlvr.it/TKLlhJ

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Semiconductor Digest

Microchip Unveils New High-Density Power Module for AI at the Edge Applications - Semiconductor Digest

AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications.

3 days ago

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candicerodriguez.com

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Industrial News

Microchip Unveils New High-Density Power Module for AI at the Edge Applications

Advanced 12A power module optimizes AI edge computing with 40% smaller footprint. Discover how this compact solution transforms industrial ...http://dlvr.it/TKLlhJ

3 days ago

Read Full Article

eeNews Europe

High density power module for edge AI

Microchip Technology has developed a fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus interfaces for edge AI designs. The MCPF1412 power module is aimed at edge AI applications with a 5.8 mm × 4.9 mm × 1.6 mm Land Grid Array (LDA) package that reduces […] The post High density power module for edge AI appeared first on eeNews Europe.

3 days ago

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