New chainmail-like material could be the future of armor
- A research team from Northwestern University has developed the first two-dimensional mechanically interlocked polymer material with 100 trillion mechanical bonds per square centimeter, the highest density ever achieved.
- The new polymer is flexible and strong, making it suitable for applications like lightweight body armor and ballistic fabrics.
- William Dichtel, the study's corresponding author, stated, 'We made a completely new polymer structure' that resembles chainmail due to its rip-resistant properties.
- The addition of just 2.5% of the new polymer to polyetherimide significantly increased the strength and toughness of the material.
Insights by Ground AI
Does this summary seem wrong?
Coverage Details
Total News Sources0
Leaning Left1Leaning Right0Center4Last UpdatedBias Distribution80% Center
Bias Distribution
- 80% of the sources are Center
80% Center
L 20%
C 80%
Factuality
To view factuality data please Upgrade to Premium
Ownership
To view ownership data please Upgrade to Vantage