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New chainmail-like material could be the future of armor

  • A research team from Northwestern University has developed the first two-dimensional mechanically interlocked polymer material with 100 trillion mechanical bonds per square centimeter, the highest density ever achieved.
  • The new polymer is flexible and strong, making it suitable for applications like lightweight body armor and ballistic fabrics.
  • William Dichtel, the study's corresponding author, stated, 'We made a completely new polymer structure' that resembles chainmail due to its rip-resistant properties.
  • The addition of just 2.5% of the new polymer to polyetherimide significantly increased the strength and toughness of the material.
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