See every side of every news story
Published loading...Updated

OKI Develops 124-Layer PCB Technology for Next-Generation Semiconductor Testing Equipment

Summary by techpowerup.com
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass production technology by October 2025 at its Joetsu Plant in Joetsu City…
DisclaimerThis story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.

4 Articles

All
Left
Center
Right
Think freely.Subscribe and get full access to Ground NewsSubscriptions start at $9.99/yearSubscribe

Bias Distribution

  • There is no tracked Bias information for the sources covering this story.
Factuality

To view factuality data please Upgrade to Premium

Ownership

To view ownership data please Upgrade to Vantage

techpowerup.com broke the news in on Friday, April 25, 2025.
Sources are mostly out of (0)

Similar News Topics

You have read out of your 5 free daily articles.

Join us as a member to unlock exclusive access to diverse content.