OKI Develops 124-Layer PCB Technology for Next-Generation Semiconductor Testing Equipment
4 Articles
4 Articles
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
Introducing at PCB East 2025 in Massachusetts, USA TOKYO--(BUSINESS WIRE)--OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB) company, has successfully develope... L'articolo OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment è un contenuto originale di 01net.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment - Semiconductor Digest
OKI Circuit Technology (“OTC”; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass …
OKI Develops 124-Layer PCB Technology for Next-Generation Semiconductor Testing Equipment
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass production technology by October 2025 at its Joetsu Plant in Joetsu City…
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