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Siemens, TSMC push chip design envelope

Summary by Mobile World Live

Siemens Digital Industries Software readied an automated workflow for Taiwan Semiconductor Manufacturing Corp’s (TSMC) high-performance wafers used in mobile and other computing applications, advancing an existing collaboration. The workflow was developed for TSMC’s InFO packaging technology, an integration method which delivers high-density interconnection and performance in silicon in 2D or 3D arrangements. Siemens employed its Innovator 3D IC…

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Mobile World Live

Siemens, TSMC push chip design envelope

Siemens Digital Industries Software readied an automated workflow for Taiwan Semiconductor Manufacturing Corp’s (TSMC) high-performance wafers used in mobile and other computing applications, advancing an existing collaboration. The workflow was developed for TSMC’s InFO packaging technology, an integration method which delivers high-density interconnection and performance in silicon in 2D or 3D arrangements. Siemens employed its Innovator 3D IC…

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Mobile World Live broke the news in 5 days ago on Monday, February 17, 2025.

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