Multi-Die Design Start Guide

Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes - Semiconductor Digest

Synopsys, Inc. announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation.

Multi-Die Design Start Guide

If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, performance, and area (PPA), functional scalability, and time-to-market advantages of multi-die designs using 2.5D and 3D technologies. The advantages are the main reason the adoption of multi-die design is on the rise. However, the reality is that mov…