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TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models

Summary by Tom's Hardware
TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120\00d7150 mm substrates with integrated power management for future AI and HPC processors.
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HD TecnologíaHD Tecnología

TSMC is developing 1000W superprocessors with 40 times higher performance than current ones

News from HD Technology. Visit www.hd-tecnologia.com for the latest news. TSMC announced a series of advances that promise to completely change the panorama of high-performance computing and AI. Among its novelties is the development of multi-chiplet packages capable of reaching up to 1000W of consumption, with interposers that multiply by 9.5 the size allowed by the current photo masks. We are talking about authentic "monsters" of silicon mount…

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Tom's HardwareTom's Hardware

TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120\00d7150 mm substrates with integrated power management for future AI and HPC processors.

Read Full Article
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Tom's Hardware broke the news in on Thursday, April 24, 2025.
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