TSMC's Cutting-Edge SoW-X Packaging Set For Mass Production By 2027; Delivering 40x Higher Computing Power Than Current CoWoS Solutions

This year's annual TSMC Technology Symposium turned into a celebration for everyone who believes that computing power requires one thing above all else: space. Lots of space. And SoW-X is supposed to deliver just that – packaged in a technology that confidently positions itself beyond traditional CoWoS boundaries. Packaging instead of silicon as a driver of innovation? Sounds absurd, but it's reality – at least according to TSMC, [...] Source

TSMC's Cutting-Edge SoW-X Packaging Set For Mass Production By 2027; Delivering 40x Higher Computing Power Than Current CoWoS Solutions

In addition to semiconductor announcements, TSMC also revealed developments with advanced packaging technologies at the Technology Symposium, announcing SoW-X. TSMC's SoW-X Packaging Technology Is Said To Take Computing Capabilities To New Heights, Offering High Performance When it comes to the importance of advanced packaging like CoWoS, it is basically one of the ways by which companies like NVIDIA have defied Moore's Law and the usual perform…